The manufacturing process of impedance FPC requires strict control of the thickness and width of the copper foil and the dielectric constant of the board to ensure the impedance control accuracy of the board. At the same time, the manufacturing of impedance FPC also requires the use of high-precision laminating and dispensing machines to ensure the precision of sheet lamination and dispensing. These process control measures can effectively improve the quality and performance of impedance FPC.
In the design process, factors such as the number of layers, wiring method, and impedance matching of the board need to be considered to ensure the signal transmission performance and stability of the board. At the same time, it is necessary to consider factors such as mechanical strength, heat resistance, and corrosion resistance of the board to ensure its reliability during use.
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Contact: Chen Changhai
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