Excellent heat resistance: Polyimide adhesive has high high-temperature mechanical properties and can withstand stress in high-temperature environments.
Good dielectric performance: Its dielectric constant and dielectric loss are both low, making it suitable for applications that require high insulation performance.
Radiation resistance: Polyimide adhesive can still maintain its excellent performance under high-energy radiation, suitable for radiation environments such as spacecraft and atomic energy industry.
Chemical stability: Polyimide adhesive has excellent stability to various organic solvents and chemical reagents, and is not easily corroded or dissolved.
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