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Wire bonding
What are the different wire bonding testing methods? 



 Cable testing

 

Wire tension testing is an important method for checking the strength and fault modes of PCB wires. This testing method requires pulling the wire vertically with a hook to determine the tensile strength and fracture mode. This type of testing is destructive and can only be conducted on a sampling basis, typically during machine setup and batch monitoring.
 


 Ball shear test

 

The ball shear test is suitable for hot ultrasonic and hot press bonding. In this destructive test, a wedge tool is placed near the ball and sheared to bond the ball. The shear strength of the ball will vary greatly depending on the bonding parameters.
 


 Pit test

 

Pit testing is a wire bonding test that uses etching techniques to reveal underlying pad cracking or damage caused by wire bonding. The chemicals used depend on the type of lead used. Validation of bonding formulas requires pit test results to understand the impact of high-level parameter values.








        
  • What considerations need to be made during wire bonding process?What considerations need to be made during wire bonding process?
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