Common Quality Issues and Improvement Methods of VIPPO
VIPPO common quality issues
A. There are bubbles inside the orifice.
B. The plug hole is incomplete.
C. Layering of resin and copper.
Results caused by quality issues
A. If there are bubbles in the hole, it is impossible to make solder pads; Gas accumulation and blowing at the hole during chip soldering, also known as out gassing.
B. Incomplete plug holes can result in no copper. In addition, if the plug hole is incomplete, there will be bubbles inside the hole, which are easy to absorb moisture, so the PCB may explode when passing through the soldering furnace. And if there are bubbles inside the hole when plugging, the bubbles will squeeze out the resin during the baking process, causing one side to be concave and the other side to be convex. So it is necessary to ensure that defective products can be detected. Boards with bubbles may not necessarily burst, because the main cause of bursting is moisture. Therefore, if it is a board that has been baked during installation or a board that has just left the factory, it generally will not cause bursting.
C、 Resin and copper delamination can cause protrusions on the solder pads, resulting in weak soldering or component detachment.
Preventive and improvement measures
Choosing the appropriate resin is crucial for pore plugs, especially in terms of the TG value and expansion coefficient of the resin material. The appropriate production process and debonding parameters are also crucial to avoid delamination between the resin and copper after heating.
Utilizing the latest advancements in electronic design automation to maximize efficiency and reliability
Perform a detailed visual inspection of each PCB using Automatic Optical Inspection (AOI) testing
Implement functional testing to ensure that each board operates properly.
Invest in top quality control systems, continuously improve and prevent defects
Establish preventive measures to detect potential production errors before they occur
Having an experienced professional team with expertise in electronic engineering, materials science, and manufacturing processes
Continuously researching new technologies and materials to further improve product performance and reliability
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