
The manufacturing process of transparent FPC is relatively complex, mainly including the following steps:
Material preparation: Select suitable transparent substrates and conductive materials, and prepare the raw materials to be produced according to the design drawings.
Circuit fabrication: Creating predetermined circuit patterns on substrates through processes such as photolithography and etching.
Layering and Covering: The conductive circuit is laminated with a transparent substrate and covered with a transparent film on the outer layer to protect the circuit.
Drilling and Electroplating: Drill through holes or installation holes as needed, and perform electroplating treatment on the hole walls.
Surface treatment: Anti oxidation treatment is applied to the surface of the circuit board to improve its corrosion resistance and weldability.
Molding and cutting: Cut the transparent FPC according to the specified size based on the designed shape to form the final board shape.
Testing and Inspection: Conduct electrical performance testing and visual inspection on the formed transparent FPC to ensure that it meets design and quality standards.
1、 Structure and Materials
2、 Characteristics and advantages
4、 Application Fieldsmobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen