FPC
TG150FR4 with adhesive-free PI
TG150FR4 TG150FR4

definition:

TG150FR4 is a type of glass fiber epoxy resin copper-clad board, which belongs to the FR4 board category. FR4 board is a substrate in circuit boards, mainly composed of glass fiber cloth and epoxy resin.

Performance characteristics:

TG150 indicates that the glass transition temperature (Tg) of the material is 150 ℃. The glass transition temperature is the temperature at which a material transitions from a glassy state to an rubbery state, and it is also the highest temperature at which a material maintains its rigidity. Therefore, TG150FR4 has high heat resistance.
In addition to heat resistance, TG150FR4 also has good moisture resistance, chemical resistance, and stability resistance.

Application:

TG150FR4 is mainly used for manufacturing printed circuit boards (PCBs), especially in applications that require high heat resistance, such as lead-free processes.

  • Polyimide (PI) without adhesivePolyimide (PI) without adhesive
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