4、 Manufacturing process-深圳市海博精密电路有限公司

The manufacturing process of ordinary FPC mainly includes the following steps:
Substrate preparation: Select suitable substrates, clean and treat them to ensure the quality of circuit production.
Conductive layer production: Coating or depositing conductive materials on the substrate to form a conductive layer.
Circuit fabrication: By using photolithography, etching and other processes, the required circuit patterns are fabricated on the conductive layer.
Cover film bonding: Attach the cover film to the surface of the circuit to protect it from external environmental damage.
Reinforcement bonding: Apply reinforcement materials to areas that require increased support strength.
Cutting and Forming: Cut and form FPC according to design requirements.
Testing and Inspection: Conduct testing and inspection on the completed FPC to ensure its quality and performance meet the requirements.

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Haibo is an expert in the field of FPC/PCB manufacturing and surface mount assembly in China. Since our establishment in 2017, we have been providing high-quality PCBs to over 1000 customers worldwide. Our factory has passed ISO14001, ISO9001:2015, TS16949, and ISO13485:2016 certifications. We are one of the most trusted small and medium-sized FPC/PCB manufacturers in China.

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Contact: Chen Changhai

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