Using power PCB also faces some challenges. Below are some of the main challenges related to power PCB.
Although the power PCB can withstand high power and high temperature, sometimes there may still be excessive heat dissipation, leading to component failures.
The PCB power board is embedded with high-power circuits. This will generate severe electromagnetic interference (EMI), thereby affecting the signal integrity of the circuit board. To reduce these impacts, certain preventive measures must be taken, such as effective grounding, shielding, and layout techniques.
The power PCB must adopt certain designs to achieve multi-layer combinations for high-power applications, which helps to provide related power distribution and signal wiring.
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