Common defects and solutions in printed circuit assembly-深圳市海博精密电路有限公司

Solder bridging:The reflow soldering step may cause solder joint failures, such as bridging. Excessive solder paste and incorrect temperature curve may cause solder to overflow and come into contact with adjacent solder pads. This may cause electrical short circuits and circuit card assembly failures.
Solution:Determining the correct amount of solder paste and evaluating the correct thermal curve will reduce the occurrence of solder bridging.

Component misalignment:If the component is not placed properly on the solder paste, or if the solder paste below the component is unbalanced, it may cause the component to shift during the reflow process. This can cause component misalignment, leading to open or short circuit faults. As the size of electronic components decreases, component alignment becomes more important.
Solution:In order to solve this circuit card assembly defect, the solder paste must be uniform and evenly and correctly distributed. The correct programming of component placement machines is also crucial for ensuring proper alignment of components.
Dehumidification:Sometimes, during the soldering process, the solder cannot fully wet the contact pads of the PCB. This situation occurs when there is oxidation on the contact pad or conductive material to be connected. Oxidation is a common phenomenon during the heating process, which is why adding nitrogen can help prevent material oxidation.
Solution:Cleaning is the key to maintaining proper wettability of the connecting material. In circuit board assembly, the shelf life, appropriate storage, and shelf life of solder paste should be controlled.
Tombstone:Another defect that affects the PCBA circuit board process is the phenomenon of standing monuments. The phenomenon of erecting a monument is caused by uneven welding, resulting in the components standing upright at one end. When the solder at both ends cannot solidify simultaneously, the force distribution of the component will not match, leading to the phenomenon of erecting a monument.
Solution:The temperature curve should be optimized to make the temperature distribution of the entire circuit board uniform. Another solution is to conduct a thorough design evaluation of the template holes to ensure that the solder on each side of the component is unbalanced.

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