The manufacturing of ceramics can adopt a combination of traditional and modern methods. Traditional processes use substrate preparation. Yes, ceramic substrates start with a commonly used material, such as aluminum oxide or aluminum nitride, which are in powder form. Then mix it with glass like material and add it to the liquid for bonding, and the mixture becomes a slurry. Afterwards, we will shape it according to our needs. Then laminate the copper-clad laminate onto the ceramic material. This will be used as our basic ceramic PCB material.

The rest of the ceramic PCB manufacturing is the same as what we follow for ordinary PCB substrates. Use CNC machine to drill holes on the substrate and add photoresist on the PCB. Lithography tools come from plotters and are used for exposure, development, etching, and stripping.

When it comes to the types of ceramic materials, they are classified based on their characteristics, which are combined together in the manufacturing process of ceramic substrates. Usually, metals such as aluminum are used as substrates. Because it has good heat transfer or dissipation performance. Although copper also has heat dissipation properties, its cost is higher compared to aluminum materials.

Aluminum oxide ceramic PCB

Aluminum Nitride PCB

Beryllium oxide PCB

Boron nitride PCB

Silicon carbide PCB

According to the material, ceramic PCBs can be divided into different types of manufacturing processes

Thick film ceramic PCB

Thin film ceramic PCB

Mixed ceramic PCB

Low temperature co fired ceramic (LTCC) PCB

High temperature co fired ceramic (HTCC) PCB

Direct Copper Coated Ceramic (DCB) PCB

Laser activated metalization (LAM) PCB

Thick film ceramic PCB is commonly referred to as thick film resistor ceramic PCB. This technology uses resistor molding to provide embedded resistors on PCBs. Form resistors on the PCB and perform laser trimming on the resistors manufactured on the PCB to ensure that all resistors have the same ohm value or different values. This helps to free up top-level space for active component placement and miniaturization purposes.

This technology is particularly used for manufacturing ceramic core PCBs. It is commonly used in thick film and thin film manufacturing methods. Vacuum deposition: It is difficult to deposit metals on any insulating material, especially on ceramic PCB boards. Due to the use of a special technique called vacuum deposition, the process involves evaporating or sputtering metal on a ceramic substrate. The result of this process is to uniformly add a layer of metal film onto the ceramic substrate.

In this method, different materials are stacked together for specific purposes or applications. For example, 370HR and ceramic aluminum PCB are used in a single stack. The purpose of using 370 HR ceramic is to resist heat. This can improve the performance and efficiency of PCB, thermal management, and so on.

When manufacturing LTCC, the PCB is placed in a gas furnace at a temperature of up to 900 degrees Celsius. The materials used to manufacture them are powder or crystal glass, metal sheets, and gold paste.

Manufacturing HTCC requires a baking process, which involves baking at a high temperature of 1600 degrees Celsius for more than 40 hours. The materials used to manufacture HTCC include plasticizers, alumina, and mixtures, which are used to mix and bond these materials.

During this process, copper and ceramics are bonded together with the help of oxygen. When the material is heated or baked to 1080 degrees Celsius, copper and oxygen combine to form a CuO eutectic liquid, which chemically combines with the ceramic material to form CuAl0O4.

The difference between DPC and DBC: Direct copper plating, as mentioned in the thin film ceramic PCB board method, involves depositing a metal (copper) thin film with a thickness of 10 µ m to 140 µ m on a ceramic substrate through vacuum sputtering process. Direct bonding of copper is a method of bonding copper to ceramic substrates, depositing metal (copper) with a thickness of 140 µ m to 350 µ m.

In LAM process, ceramics and metals are ionized through high-power laser drilling technology. The result of this process is the formation of a bond between two substances, resulting in a smoother surface.

Memory modules, such as RAM

photovoltaic panel

LED light PCB board

EADS

Bioceramics

metal industry

If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects

Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.