Materials: High speed FR4, low Dk and low Df materials, ceramic filling PTFE、 Teflon, Arlon, Rogers, AGC, Isola, Panasonic Shengyi, TUC, Taconic, Ventec, etc.
Impedance control, peelable mask, carbon ink, back drill
ISO9001: 2015 certification and UL certification
PCB type: FR4, PTFE FR4 hybrid, ceramic FR4 hybrid
Impedance tolerance: minimum/-5%
PTH、 Blind holes, buried holes, staggered holes, stacked holes
放大器 PCB 是用于放大器的印刷电路板。放大器 PCB 电路用于改善发送到所连接设备的信号。大多数放大器 PCB 用于声音应用。放大器 PCB 的其他各种用途是增强输入数据、视频和另一个次级电路的高速信号。放大器电路 PCB 通过为电路提供额外的电源来增强信号强度。放大器的电路大小取决于产品的应用及其需求。
由于放大器 PCB 电路结构紧凑且不使用通孔元件,因此需要使用 SMD 设备中的所有物理元件进行设计。
放大器 PCB 通常设计有扬声器和保护电路,其中整流器以重占空比运行。
外形尺寸是放大器 PCB 的关键点之一。必须重点关注 PCB 中的散热,因为散热会影响电路的性能和元件的使用寿命。
PCB的介电常数设计得比任何标准刚性PCB更好,以满足设计和性能约束。
放大器 PCB 电路具有高输入阻抗,可防止馈入次级设备的信号丢失。放大器 PCB 设计采用无阻抗或低阻抗设计,因为这可能会导致电压下降,从而导致电路功能中的信号丢失。
对于放大器 PCB 所需的所有变量约束,开环增益在反馈水平上都很高。
放大器 PCB 的信号带宽受限于一定范围。PCB 设计需要以保持窄带区的方式进行设计。宽带设计可能会导致噪声和多个信号干扰。
PCB放大器的输出阻抗很低,放大器设计的原理是在放大信号时降低电压。
放大器还可以通过改善信号频率响应、降低失真程度和增强整体声音特性来改善声音质量。
放大器的维护也需要无尘,以防止过热并维持性能。
Reliability: The amplifier PCB must operate reliably for a long time to achieve the specified output. The sustained performance of these PCBs (without any defects or errors) plays a crucial role.
Scalability: The size and design stages of amplifier PCBs vary from small circuit designs to large or high-precision circuit designs. This makes its application scope wide enough to be suitable for various industries.
Cost reduction: Due to the reduced size, the manufacturing process is simpler, and the cost of amplifier PCB is also lower. The assembly and manufacturing types aim to reduce time and process complexity, thereby lowering production costs.
Repair cost: The maintenance cost of amplifier PCB is relatively low and it is easy to identify defects. Troubleshooting is also easier and more cost-effective.
Signal integrity: The signal integrity of the PCB has been improved, and the output of the amplifier is clear and accurate.
Home audio system: The amplifier PCB is designed for use in home theater systems, equipped with stereo amplifiers, transmitters, and receivers for a high-precision audio experience.
Studio amplifier: Audio amplifiers and other amplifier types are used for live recording in studios and recording stations, requiring precise performance and reliability. Specific audio devices can record and transmit small and sensitive audio, and can also be used for multi room connections.
Portable audio devices: Portable devices, Bluetooth earphones, speakers, and personal devices need to provide perfect sound quality when powered by batteries. Most of these devices use Bluetooth driver technology or Wi Fi connection during operation.
Industrial applications: Various amplifier devices are used in the industrial field to handle mechanical operations, address or notify crowded places, communication and wireless network devices. Industrial automation and smart home and control equipment use high-precision amplifier PCB design.
Medical equipment: Many hearing aids can assist humans and animals in correctly amplifying conditions. Various diagnostic devices use PCB based amplifiers to achieve better performance.
Automotive industry: Car audio systems include speakers, loudspeakers, subwoofers, and customized Bluetooth communication devices, which can provide clear high-power audio.
The layout and wiring of the amplifier PCB determine the performance and reliability of the circuit board.
The design of amplifier PCB is very important because signal attenuation can affect devices such as audio amplifiers, microphones, speakers, Wi Fi, etc.
If the amplifier PCB circuit layout is scattered, the layout configuration will cause additional parasitic capacitance, leakage current, and interference such as resistance and diode leakage.
Improper layout design may cause overheating of components due to uneven power distribution on copper wires.
The key concepts in amplifier PCB design are passive components, linearity, extension time, and signal integrity.
All components in the amplifier PCB are selected at the schematic level and must be placed on the PCB according to the layout guidelines.
Layout considerations also start with the application of PCB amplifiers, as some applications (such as theaters and heavy-duty speaker equipment) require 6 or more PCB layers.
Most amplifiers adopt a four layer stacked structure. The top layer is usually the signal layer, the second and third layers are the ground layers, and the bottom layer is a mixed layer of the signal layer and the power layer.
The decoupler must be placed near the pins. The minimum capacitance value and packaging size must be placed near the IC power pins.
The wiring path must be sufficient to carry power, and the via cannot be located between pins or critical signal lines.
The amplifier design consists of primary and secondary side pins. The primary and secondary pins are powered by different power sources.
The power pin and ground pin are connected using star grounding technology.
The other two types of capacitors are crucial for signal design in PCB amplifier circuits, namely switch capacitors and pump capacitors. This can achieve soft switching of signals without generating switching noise that affects adjacent signals or power lines.
Charge pump capacitors must have small parasitic capacitance and low inductance. Among these design styles, it is best to use high line density to minimize parasitic noise to the greatest extent possible.
The D-class output signal needs to be sent in two layers of PCB, with a minimum trace width of 30 mil and an output trace width of at least 60 mil.
If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects
Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen