What are the advantages and disadvantages of different types of PCB surface treatments?-深圳市海博精密电路有限公司

Surface Treatment	cost	quality guarantee period	solderability	Advantages and disadvantages
HAL containing lead	normal	12 months	tall	High cost-effectiveness and high production efficiency. Very good weldability. Not compliant with RoHS/REACH standards. Not applicable when the distance between the soldering pins is less than 0.5mm. Not suitable for BGA because it is not smooth enough.
No PB HAL	normal	12 months	tall	High cost-effectiveness and high production efficiency. Very good weldability. Not suitable for welding needles with a distance less than 0.5mm. Not suitable for BGA because it is not smooth enough.
OSP	low	6 months	normal	High cost-effectiveness and high production efficiency. Not suitable for mixed assembly of PTH and SMT. Poor thermal stability. After the first reflow soldering, the PCB should usually be soldered within 14 hours. Not suitable for PCBs with EMI grounding areas, mounting holes, and test pads. It is also not suitable for crimping holes.
Gold plating	tall	12 months	tall	Good weldability, excellent conductivity, long shelf life, very durable and stable. The surface is very smooth and suitable for fine spacing. The optimal solution for edge connectors requires multiple insertions and removals, which is very costly. There is a risk of embrittlement in welding points/seams.
Immersion Gold	tall	12 months	tall	Good weldability, excellent conductivity, long shelf life, very durable and stable. The surface is very smooth and suitable for fine spacing. There is a risk of 'black solder pad' issues.
immersion silver	normal	6 months	tall	Excellent weldability and high cost-effectiveness. The surface is very smooth, suitable for small ICs. Easy to sulfurize (sensitive to sulfur), non welding areas are prone to discoloration at high temperatures.
Immersion Tin	normal	6 months	tall	Excellent solderability, high cost-effectiveness, very smooth surface, suitable for small integrated circuits, high requirements for tin dipping chemicals
England Pig	tall	12 months	tall	There is no risk of 'black pad', and the surface treatment is very durable and stable. It is a perfect alternative to OSP or ENIG. But the cost is relatively high.

Surface Treatment

cost

quality guarantee period

solderability

Advantages and disadvantages

HAL containing lead

normal

12 months

tall

High cost-effectiveness and high production efficiency. Very good weldability. Not compliant with RoHS/REACH standards. Not applicable when the distance between the soldering pins is less than 0.5mm. Not suitable for BGA because it is not smooth enough.

No PB HAL

normal

12 months

tall

High cost-effectiveness and high production efficiency. Very good weldability. Not suitable for welding needles with a distance less than 0.5mm. Not suitable for BGA because it is not smooth enough.

OSP

low

6 months

normal

High cost-effectiveness and high production efficiency. Not suitable for mixed assembly of PTH and SMT. Poor thermal stability. After the first reflow soldering, the PCB should usually be soldered within 14 hours. Not suitable for PCBs with EMI grounding areas, mounting holes, and test pads. It is also not suitable for crimping holes.

Gold plating

tall

12 months

tall

Good weldability, excellent conductivity, long shelf life, very durable and stable. The surface is very smooth and suitable for fine spacing. The optimal solution for edge connectors requires multiple insertions and removals, which is very costly. There is a risk of embrittlement in welding points/seams.

Immersion Gold

tall

12 months

tall

Good weldability, excellent conductivity, long shelf life, very durable and stable. The surface is very smooth and suitable for fine spacing. There is a risk of 'black solder pad' issues.

immersion silver

normal

6 months

tall

Excellent weldability and high cost-effectiveness. The surface is very smooth, suitable for small ICs. Easy to sulfurize (sensitive to sulfur), non welding areas are prone to discoloration at high temperatures.

Immersion Tin

normal

6 months

tall

Excellent solderability, high cost-effectiveness, very smooth surface, suitable for small integrated circuits, high requirements for tin dipping chemicals

England Pig

tall

12 months

tall

There is no risk of 'black pad', and the surface treatment is very durable and stable. It is a perfect alternative to OSP or ENIG. But the cost is relatively high.

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