The main steps of multi-layer PCB manufacturing-深圳市海博精密电路有限公司

The main steps of manufacturing multi-layer printed circuit boards are the same as the above process, except that some additional steps need to be performed to achieve the final stacking. In order to achieve multi-layer PCB, multiple pre impregnated materials (glass fiber materials) need to be stacked on a copper-clad laminate. The copper-clad laminate in PCB manufacturing is a product of the lamination process. This process involves applying copper foil to both sides of FR-4 substrates or "laminates" bonded together by heat and pressure. Heating will trigger a chemical reaction in the bonding layer, thereby bonding the PCB layers together.

Drill holes after final lamination. Pattern on a single layer. Since the component does not come into contact with the inner layer, surface treatment is not required. Then perform other conventional processes on the multi-layer board, such as through-hole filling, pattern application, and electroplating.

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