3、 Manufacturing process-深圳市海博精密电路有限公司

The manufacturing process of high-temperature resistant FPC is relatively complex, mainly including the following steps:
Material preparation: Select suitable substrates and copper foils, and prepare the raw materials to be produced according to the design drawings.
Circuit fabrication: Creating predetermined circuit patterns on substrates through processes such as photolithography and etching.
Layering and Covering: Layering multiple layers of materials together and applying a covering film on the outer layer to protect the circuit.
Drilling and Electroplating: Drill through holes, through holes, or installation holes according to the design drawings, and electroplate the hole walls to improve conductivity.
Surface treatment: Anti oxidation treatment is applied to the surface of the circuit board to improve its corrosion resistance and weldability.
Forming and cutting: Punch the FPC according to the specified size based on the designed shape to form the final board shape.
Testing and Inspection: Conduct electrical performance testing and visual inspection on the formed FPC to ensure that it meets design and quality standards.

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Haibo is an expert in the field of FPC/PCB manufacturing and surface mount assembly in China. Since our establishment in 2017, we have been providing high-quality PCBs to over 1000 customers worldwide. Our factory has passed ISO14001, ISO9001:2015, TS16949, and ISO13485:2016 certifications. We are one of the most trusted small and medium-sized FPC/PCB manufacturers in China.

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Contact: Chen Changhai

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