PCB
Multi layer PCB
Different types of vias in multi-layer PCBs Different types of vias in multi-layer PCBs

Through hole drilling (including through holes): Through hole drilling or through holes means that all boreholes are connected from top to bottom to each layer.

Blind hole: Blind hole refers to the connection between the top or bottom layer and the inner layer through a through-hole, as shown in the following figure.

Buried hole: Buried hole refers to all through holes connected to the inner layer. The buried hole will never connect to the outer layer.

Stacked via: Stacked via is defined as a through-hole connected in a straight line from the outer layer to the inner layer for the easiest wiring and correct electrical connection.

Interlocking via: Interlocking via refers to a via that is not connected to adjacent layers in a straight line. Its connection with adjacent layers has a certain angle, as shown in Figure 2.

Micro pores: Micro pores are pores smaller than 0.15 millimeters. Stacking and interleaving are both micro vias, which generally exist on HDI multi-layer PCBs.

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