High thermal stability: MPI adhesive free polyimide can withstand stress in high-temperature environments, with a thermal decomposition temperature typically above 500 ℃, making it suitable for high-temperature working environments.
Excellent electrical performance: With extremely low dielectric constant and dielectric loss, as well as high dielectric strength, it is an ideal choice for electrical insulation materials.
Good mechanical performance: It has high tensile strength and toughness, can resist external impact and tearing, and maintain structural integrity.
Chemical stability: It has good stability against various organic solvents and chemical reagents, and is not easily corroded or dissolved.
Low water absorption rate: helps maintain the electrical and mechanical stability of materials in humid environments.
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