3、 Manufacturing process-深圳市海博精密电路有限公司

The manufacturing process of blind hole FPC is relatively complex, mainly including the following steps:
Inner layer circuit fabrication: Inner layer circuits are fabricated on the substrate, and predetermined circuit patterns are formed through processes such as photolithography and etching.
Burial hole fabrication: Use laser or mechanical methods to create buried holes at designated locations. This step requires precise control of the depth and position of the borehole to ensure that the buried hole can be correctly connected to the designated inner line.
Blind hole production: To produce blind holes at the required locations, precise control of the drilling depth and position is also required.
De drilling and metalization: After drilling, there will be some impurities such as drill cuttings and oil stains remaining on the hole wall, which need to be treated for de drilling. Afterwards, metallization treatments such as electroless copper plating and electroplated copper are carried out to form a conductive layer on the hole wall.
Layering and Outer Circuit Manufacturing: Layering multiple layers of materials together and creating conductive circuits on the outer layer. This step requires ensuring tight bonding between layers and stable electrical performance.
Surface treatment and cover film bonding: Apply anti-oxidation treatment to the surface of the circuit board and bond the cover film at designated locations to protect the circuit.
Molding and Inspection: Cutting, bending, and other molding processes are carried out on circuit boards, and strict quality inspections are conducted to ensure that they meet design and usage standards.

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