High current carrying capacity: Due to the thick copper foil layer, thick copper FPCs can withstand higher current densities, making them suitable for applications that require high current transmission.
Good heat dissipation performance: A thicker copper foil layer facilitates rapid heat conduction and dissipation, thereby improving the heat dissipation performance of the circuit board.
Enhanced mechanical strength: The thick copper foil layer increases the overall mechanical strength of the circuit board, making it more durable and reliable.
Adapting to complex environments: Thick copper FPC still maintains the bendable and foldable characteristics of flexible circuit boards, and can adapt to various complex shapes and spatial layout requirements.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen