Thick copper FPC is a type of circuit board made of flexible copper-clad board as the substrate, characterized by an increase in the thickness of the conductive layer copper foil compared to traditional FPC. This increased copper foil thickness is usually designed to meet specific electrical performance requirements, such as withstanding higher current densities and providing better heat dissipation performance. The structure of thick copper FPC is similar to traditional FPC, including insulation film, conductive layer (copper foil), adhesive and other components.
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