3、 Manufacturing process-深圳市海博精密电路有限公司

The manufacturing process of thick copper FPC is relatively complex and requires improvement and optimization on the basis of traditional FPC manufacturing process. The main process steps include:
Substrate preparation: Select suitable flexible copper-clad laminates as substrates to ensure excellent electrical performance and mechanical strength.
Copper foil processing: Thick copper foil layers are produced using methods such as electrodeposition or plating to meet specific electrical performance requirements.
Circuit fabrication: Creating circuit patterns on copper foil through processes such as photolithography and etching.
Layering and bonding: laminating and bonding components such as insulation films and copper foil layers to form a complete circuit board structure.
Surface treatment: Surface treatment of circuit boards, such as immersion gold, gold plating, etc., to improve their solderability and corrosion resistance.
Testing and Inspection: Conduct circuit connectivity and functional testing to ensure product quality meets standards.

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Haibo is an expert in the field of FPC/PCB manufacturing and surface mount assembly in China. Since our establishment in 2017, we have been providing high-quality PCBs to over 1000 customers worldwide. Our factory has passed ISO14001, ISO9001:2015, TS16949, and ISO13485:2016 certifications. We are one of the most trusted small and medium-sized FPC/PCB manufacturers in China.

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Contact: Chen Changhai

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