High density interconnection: HDI technology greatly increases the density of lines and vias on circuit boards, thereby improving the integration and signal transmission speed of circuit boards.
Rigid flexible combination: The rigid region provides stable support and connection, while the flexible region allows the circuit board to freely bend and fold in three-dimensional space, adapting to various complex shapes and structural requirements.
Improved performance: HDI soft hard integrated boards have smaller line widths and spacing, lower impedance losses, and more complete signal transmission quality, thereby improving the overall performance of the circuit board.
Reduce volume and weight: By optimizing the circuit layout and stacking structure, HDI soft hard composite boards can reduce volume and weight while maintaining high performance.
High reliability: HDI soft hard composite board adopts advanced manufacturing technology and materials, with higher reliability and stability, suitable for various harsh application environments.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen