Key considerations for HDI PCB design and manufacturing-深圳市海博精密电路有限公司

The important steps to consider when designing high-density interconnect PCBs depend on various factors such as components, stacking, material properties, and design rules.

The number of layers on the HDI PCB board is determined by BGA IC recommendations or depends on the network crossing direction and routing length for specific applications.

Manufacturing capability is set according to design rules, as the prerequisite must meet PCB stacking or manufacturing design (DFM).

The through-hole properties and the usage of vias across all layers are used to interconnect all networks between the inner layers, determining the thickness and number of layers of HDI multi-layer PCBs.

Assembly or real-time environment should not cause pressure or damage to HDI circuit boards, and reliability should be checked according to PCB.

The reliability of HDI circuit boards also benefits from the printing capabilities of HDI PCB manufacturers, including wire width, tear drops, and assembly components. This ensures the manufacturability, distributability, and performance reliability of the design.

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