High frequency and high-speed FPCs are typically composed of multiple layers, including conductive layers, insulating layers, and cover films. The key materials and structural characteristics are as follows:
Conductive layer: Made of high conductivity copper foil material to ensure stable signal transmission. Meanwhile, the thickness and width of the copper foil are precisely designed to meet the requirements of high-frequency and high-speed signal transmission.
Insulation layer: using insulation materials with excellent dielectric and heat resistance properties, such as polyimide (PI) or polyester (PET). These materials can reduce signal loss and interference during transmission, and improve the overall performance of the circuit board.
Cover film: used to protect circuits and components, preventing damage to circuit boards from external environments. The covering film is usually made of the same material as the insulation layer and undergoes special treatment to improve its wear resistance and corrosion resistance.
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