
The manufacturing process of high-frequency FPC is relatively complex, requiring high-precision process control and advanced production equipment. It mainly includes the following steps:
Material selection: Choose conductive and insulating materials with excellent high-frequency performance.
Circuit fabrication: High frequency circuits are fabricated on substrates through processes such as photolithography and etching.
Layering and Drilling: Layering multiple layers of materials together and drilling holes at desired locations to form electrical connections.
Electroplating and surface treatment: Electroplating treatment is applied to drill holes to form a conductive layer, and anti-oxidation treatment is applied to the surface of the circuit board.
Cover film bonding and reinforcement: Apply a cover film to the surface of the circuit board to protect the circuit, and paste reinforcement materials at areas where support strength needs to be increased.
Molding and Inspection: Cutting, bending, and other molding processes are carried out on circuit boards, and strict quality inspections are conducted to ensure that they meet design and usage standards.
1、 Structural characteristics
3、 Application Fields
4、 Advantages and Challengesmobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen