The manufacturing process of high-frequency FPC is relatively complex, requiring high-precision process control and advanced production equipment. It mainly includes the following steps:
Material selection: Choose conductive and insulating materials with excellent high-frequency performance.
Circuit fabrication: High frequency circuits are fabricated on substrates through processes such as photolithography and etching.
Layering and Drilling: Layering multiple layers of materials together and drilling holes at desired locations to form electrical connections.
Electroplating and surface treatment: Electroplating treatment is applied to drill holes to form a conductive layer, and anti-oxidation treatment is applied to the surface of the circuit board.
Cover film bonding and reinforcement: Apply a cover film to the surface of the circuit board to protect the circuit, and paste reinforcement materials at areas where support strength needs to be increased.
Molding and Inspection: Cutting, bending, and other molding processes are carried out on circuit boards, and strict quality inspections are conducted to ensure that they meet design and usage standards.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen