Compared to SMT board assembly, through-hole technology requires more space to connect to FPC. SMT circuit board assembly can achieve more compact and lightweight designs, which is beneficial for various applications such as wearable and portable devices.
Due to the low lead inductance and capacitance in high-frequency applications, reducing signal noise is a major advantage of SMT assembly. Different component types and packaging are suitable for SMT assembly technology.
With SMT assembly, printed circuit boards can be produced at an extremely fast speed using high-speed machines. Even FPC manufacturing has become simpler as there is no need to drill holes to insert lead packages.
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