PCB manufacturing, component procurement, and PCB assembly
Whole machine assembly and system integration
Electronic testing, ICT testing, functional testing, and aging testing
Reliability testing and environmental testing
Small to medium batch production
Passed ISO9001:2015 ISO 13485: 2016 certification and UL certification
PCBA的全称是 印刷电路板装配在印刷电路板组装的批量生产过程中,由于设备和操作人员的各种潜在因素,无法确认组装的印刷电路板全部为完好产品。需要在组装结束时附加一系列测试仪器和测试设备,以确认各个工厂的实际印刷电路和各种规格参数的设计完全一致。
电路板组装测试是指PCB组装服务(即安装有电子元件的印刷电路)的电物理现象,还包括输入和输出值的检测。
PCBA 实际测试不仅测试零件,还测试整个电路板的运行。此印刷电路测试模拟需要实际组装的相关环境。通过实际测试,在 ECM(电子合同制造商)将其运送到初始仪器制造商(OEM、ODM)之前,最多 100% 的 PCB 都经过测试。
PCBA在线测试是在一开始就测试我们制作的板子是否符合实际设计的要求的一种方法,从而根据测试目的与上位机软件的电气连接或者收集到的SMT贴片工艺、DIP插件工艺完成后的印刷电路的数据来决定工艺是否合格。
为了避免不良产品质量,PCB功能测试无疑是不可省略的一个环节。毫不夸张地说,一家公司的品牌声誉与PCBA紧密相连。难怪实用的PCBA(印刷电路板)测试被视为生产过程中的顶级方法。
PCB组装工艺流程非常先进,包括PCB制板工艺、元器件采购及审核、SMT贴片组装、DIP插件、印刷电路板组装测试等多个重要工序。具体来说,电路板组装测试是整个过程中最重要的内部控制环节,决定着产品的最终性能。能列举几种PCB板组装测试吗?下面就由晶小编来为大家介绍一下。
特别的是,Viasion一直致力于通过电路板组装测试来确保质量问题。PCBA测试对于确保每件产品的质量是必不可少的,这样才能避免在生产和加工货物的过程中因仪表使用不当或处理不当而导致的问题,达到绝对的符合标准。
我们将了解PCBA测试中主要包括的ICT测试、FCT测试、老化测试、疲劳测试、以及恶劣环境测试。
ICT信号中最多的包括电路的通断、电压、电流值、波动曲线、幅值、噪声等。
值得注意的是,FCT 测试涉及 IC 程序的老化和整个 PCBA 板操作的模拟。该测试还专门针对硬件和软件系统之间的问题等。顺便说一句,我们不能忘记这项测试还涵盖了强制性的放置过程和生产夹具和检查架。
疲劳测试特别是对电路板进行取样,做高频次及长时间的运转,观察有无失效,在试验期间判断失效的可能性,并发回有关组装好的电路板在运行中电子产品性能的数据。
恶劣环境试验是专门对PCB组装板进行极限温度、湿度、跌落、溅水、振动等试验,得出随机样品的试验结果,从而推断整批PCB板产品的可靠性。
老化测试就是对PCBA板与电子产品进行长时间通电,运行,观察有无故障,老化测试完成后电子产品批量出售。
提高企业的组装能力:电子PCB组装测试的合格率越高,产品的合格率就越高,可以提高产品的水平,提升企业的组装能力。
提升企业经济效益:只有经得起考验的产品才会被用户所喜爱,在测试的过程中,可以及时发现错误并做出修改,使产品更加完善,这样产品一旦投入市场就会受到用户的青睐,从而促进企业经济效益的发展。
PWB组装测试是保证产品质量不可缺少的重要环节。电路卡组装测试有以下好处。
印刷电路板测试有利于提高产品的合格率,提升产品的质量。
PCB板测试有利于提升客户满意度,通过测试可以筛选出不良品,并进行修改,防止不良品流入市场。
电子组装测试有利于提高销售业绩,优质的产品能带来良好的口碑,扩大市场份额,提高销售业绩。
印刷电路板组装测试的常见方法如下:
从它的名字就可以看出它的含义。这种直接依赖视觉测试的手动测试被广泛使用。然而,它的弊端也越来越明显。不幸的是,这种方法在某种程度上越来越不合适。此外,这种测试往往不容易发现一些实际的缺陷,对各种信息进行分类相当具有挑战性。
关于这个测试,大多数人都熟悉简写“AOI”。它是一种更好的极性测试对元素的影响。诊断后直接进行,是一种相对常见的方法,但是,这种方法对于切线识别效果不佳。
过去几年,飞针测试在机械的精度、速度和可靠性方面取得了长足的进步,在确保产品质量方面表现出色。此外,目前对快速切换和免夹具能力的检测系统的需求,例如生产和小批量生产,使得飞针测试成为最有效的选择。
功能测试作为PCB或电池的检测手段,需要专门的仪器设备才能进行,主要涉及成品检测和热模拟。
这种测试值得推荐,因为它具有以下优点:价格低廉、吞吐量高、后续鉴定简单、快速完成切割线和电路测试。不幸的是,这种测试并不完美。它不允许进行功能测试。在过程中必须使用夹子,最致命的是,测试成本高昂。是否应用这种测试取决于其优缺点。
Can you name several common soldering circuit board testing instruments? Let's reveal the answer. The ICT online tester, FCT operation testing, and aging testing constitute the equipment for PWB assembly testing.
ICT has the advantages of wide application range and simple operation, and is highly praised. To achieve the purpose of detecting open circuits, short circuits, component damage, etc., it is indeed necessary to have the help of this effective testing method. In addition, it can accurately locate the fault location for easy maintenance.
Generally speaking, products that pass ICT testing can be transferred to functional testing. FCT functional testing mainly tests the corresponding functions of each product to determine whether the product is in good condition. More specifically, it refers to a testing method that provides a simulated operating environment for the testing target printed circuit board, allowing it to run in various design states and obtain parameters in each state to verify the functionality of the testing target printed circuit board.
Aging testing generally simulates the external environment on the finished circuit board with assembled components. It simulates the daily use environment of the product through the comprehensive effects of high temperature, low temperature, high and low temperature changes, and electrical power. Defects in the assembly of the circuit board, such as poor soldering, inconsistent component parameters, and faults caused during debugging, are eliminated and improved to stabilize the parameters of the defect free PCB assembly board. PCBA boards that are consistent with electronic products are subjected to long-term simulation of consumer use for input/output testing to confirm their performance meets market demand.
These three types of testing instruments are common in the PWB assembly process. Our company Viasion attaches great importance to circuit board testing in the assembly and processing of circuit boards. Therefore, the customer has provided feedback that the PCB assembly we delivered fully meets the requirements. In addition, the repair rate of our products has also been greatly reduced.
PCB soldering test fixture is an important testing instrument in PCBA process factories, usually placed at the end of the assembly process to test whether the product is intact. When making and testing PCB assembly test fixtures, it is necessary to meet the required requirements to improve the accuracy of testing and enhance delivery quality.
Circuit board assembly testing fixture is a specialized fixture used to test and inspect the operation, power, lifespan, performance, etc. of products. Therefore, it is mainly used for testing various indicators of products on PCB assembly lines, and is also known as printed circuit assembly testing fixture.
In Circuit Testing (ICT) mainly includes circuit on-off, voltage and current values, fluctuation curves, amplitudes, noise, etc.
2. The purpose of FCT testing is to identify boards with assembly defects. By simulating the full functional testing of boards when assembled into a complete machine, all possible defects that may exist before the circuit board is assembled into the whole machine can be identified, avoiding the waste of time and material loss caused by disassembling and reassembling the entire board after assembly.
3. Fatigue testing is responsible for sampling high-frequency and long-term PCB assembly services to observe whether products have malfunctioned. Undoubtedly, the probability of failure occurring during the experiment can also be well judged. Another point to note is that it can provide good feedback on the operational performance of circuit boards in electronic products. This allows us to make timely adjustments to the problem.
4. Harsh environment testing is specifically conducted on PCBA boards to test for extreme temperatures, humidity, drops, splashes, vibrations, etc., and obtain test results from random samples to infer the reliability of the entire batch of PCBA board products.
5. Aging testing is a specialized method for testing the aging of electronic products. After mass sales, the circuit board assembly board and electronic products are powered on for a long time, kept running, and observed for any faults.
1. According to the testing requirements and test board, after selecting the control mode, the fixture structure type is determined, and the load board, pressure plate, and instrument module are designed. The fixture load board/pressure plate is inexpensive.
2. The fixture should be positioned correctly, and the instrument binding should be smooth.
3. The layout cost of the fixture box is low, saving wiring and installation in the system area.
4. Fiber optic/MIC/SPK/SIM card analog slots should be reserved and positioned accurately.
5. The reserved interface positions for fixtures should be correct, sufficient, and reasonably arranged.
6. The lock of the lighting fixture box should be in the form of a box buckle or pressure buckle for easy replacement and maintenance.
7. Correct zero point correction. The zero drift of the testing fixture will be corrected with changes in testing conditions or the replacement of different testing fixtures, so zero correction for open circuits and tangents is very necessary. Therefore, the FCT test fixture has circuit and tangent correction settings.
Once the fixture breaks or ages, the needle should be replaced for repair and continued to be used. If the fixture breaks after repair and the customer no longer uses it, it must be remade.
Printed circuit assembly testing fixtures are sometimes customized for selected products, which can effectively improve productivity and transportation quality.
The production method of PCB batch testing fixtures is as follows:
1. Select the final fixture control method based on the tested product and customer testing requirements, and design the pressure plate, load plate, and conversion module.
2. The position of the clamping plate or load plate inside the specimen should be correct, and the test piece should not be pressed onto the test plate.
3. The positioning of the testing fixture should be correct, and the instrument binding should be smooth.
4. The test fixture can have a precise box style, and the test product should be placed inside the box style. The internal style of the fixture should reserve sufficient area in the box, and the box layout should be cheap.
5. The reserved interface positions for testing fixtures should be correct, sufficient, and reasonably arranged.
After the PCBA test fixture is formed, simply swing the PCBA board into the test fixture to complete the positioning of the PCBA board and the test fixture. The accuracy of positioning is closely related to the manufacturing process of the test fixture.
To confirm the integrity and accuracy of the product and avoid excessive rework caused by assembly processes and operating methods, PCBA manufacturers can use PCBA testing to solve problems. However, the industry also emphasizes that PCBA testing is not omnipotent, and there are still several areas that need to be noted in the actual operation process.
In PCBA testing, the following aspects should be noted:
When PCBA needs to be upgraded, most motherboards will undergo significant changes. Industry insiders emphasize that traditional batch production of PCBA motherboards from different periods cannot be mixed with after-sales motherboards, because once mixed batch production occurs, it is easy to run into mixed batch boards, which is detrimental to the later use of electronic products. Therefore, when testing and assembling PCBA, it is important to determine whether the final usage code meets the customer's requirements.
●Before PCBA testing and assembly, the dirt on the fingers should be removed first. It is best to wipe them with dust-free material and alcohol, and then do so again to avoid the user's hands being unable to perform certain key operations on the circuit card due to these dirt.
●Anti static measures must be taken, whether it is PCBA testing and assembly or other processes. The purpose of this step is to avoid poor contact or power on of electronic products during use, thereby improving product quality and user experience.
This section mainly includes testing of circuit switching, current value, voltage, amplitude, noise, etc., to check whether PCB manufacturing and assembly are normal.
Its purpose is to test the entire PCBA circuit board after IC program placement, check for code and hardware issues, and equip it with corresponding placement process fixtures and testing racks.
By analyzing the results of PCB manufacturing and assembly samples that have undergone this test, we can understand the functional operation of the PCB assembly board and determine whether there are any faulty areas. For example, if the mouse is clicked up to 100000 times or the LED is turned on and off 10000 times, the possibility of a malfunction is tested. Therefore, the above example can demonstrate that the performance of the PCBA board has been fully demonstrated through this test.
This includes testing circuit cards under extreme conditions such as temperature and humidity, drops, splashes, impacts, etc. Therefore, random samples can be obtained and the standard responsibility of the entire printed circuit component can be inferred.
It mainly observes whether there is a fault intuitively by powering on the assembled circuit board and electronic products for a long time and maintaining their operating state. It is worth noting that only after this step of testing will it be put into the market and sold in factories.
The assembly and testing process of electronic circuit boards is quite complex and plays a crucial role in the entire production process. Without this process, products will experience high failures and rework, which is very detrimental to the development of enterprises. Through the assembly testing and assembly process of printed circuit boards, enterprises can timely understand the quality and effectiveness of their products, make timely improvements based on problems, ensure product reliability, and create a favorable environment for the development of the enterprise and the establishment of its brand.
The principle of the electronic board assembly test bench is very simple, which is to stick the solder pads or components to be tested onto the PCB board through metal probes. When the PCB board is powered on, standard values such as voltage and current of the test circuit will be obtained to observe whether the test circuit is normal.
The production of printed circuit board assembly PCBA test stands is customized according to the size of the test PCB board, the location of the test purpose, the values to be tested, and other requirements. Acrylic, plastic, metal probes, displays, and wires can be used at most, and simple PCB circuit cards can be equipped to complete the entire production.
The PCB printed circuit board assembly test bench is widely used in the entire process of customized circuit board assembly, mainly for testing the assembled circuit board after SMT surface mount and DIP plug-in are completed.
●ICT testing mainly tests the conductivity of the circuit board through testing points to confirm whether the entire PCB board has been successfully soldered.
●The circuit board assembly service testing rack is the main tool to assist in completing this testing.
●The quality of customized PCB assembly test bench is directly related to the effectiveness and pass rate of ICT testing. Due to the frequent long-term operation of PCBA, PCBA foundries have high requirements for its production quality, which must be given sufficient attention.
FCT (Functional Test) refers to a testing method that provides a simulated working environment (excitation and load) for the test target board (UUT: Unit Under Test) to work in various design states, obtain parameters for each state, and verify the functionality of UUT. In short, it is to load appropriate excitation to UUT and measure whether its output response meets the requirements. Generally refers to the functional testing of circuit card components.
1. Power test: Test whether the power supply is working properly; Test the voltage at each point
2. Port (interface) testing: testing for short circuits or open circuits that may cause functional abnormalities.
3. Special function testing (different boards have different requirements for special function testing)
system control center
This part is generally composed of small and medium-sized central processing units such as PCs, MCUs, ARM, etc. Its main function is to control the progress of the entire testing process, judge and record the testing content of each step, and finally obtain the test results. It is the core brain of the entire testing system.
Control and Execution
The control and execution part is mainly composed of I/O components, which are the induction and execution mechanism of logical actions in the testing process. The functional testing system uses it to build various testing environments and achieve testing functions.
PARAMETERS
The measurement part is mainly composed of some boards and instruments used for measurement, mainly responsible for collecting various analog or digital quantities during the experimental process, so sometimes we also refer to it as the data acquisition part.
Data processing and output
The test results of each step and the final test results are the purpose of our entire testing. Data processing and output are responsible for storing and outputting these results and data, which makes it more convenient for us to effectively control the quality of PCBA products.
PCBA electrical characteristic testing mainly includes the following aspects.
1. Current test: This test detects whether the circuit board has current exposure issues. If the current is lower than the design specifications, the test passes.
2. Voltage test: Test the withstand voltage capability of the circuit board by gradually increasing the voltage. If there is no malfunction in the circuit, the test passes.
3. Impedance testing: Impedance is an important parameter for testing circuits and components, referring to the resistance of components or circuits to current passing through them. Generally, an ohmmeter is needed to test impedance, and if the impedance value is within the specified range, the test passes.
The ICT testing, FCT testing, aging testing, fatigue testing, and harsh environment testing discussed above all belong to reliability testing.
The purpose of the test is to check the compressive strength of the board, and the required equipment is a pressure tester.
The purpose of salt spray testing is to check the corrosion resistance of circuit boards, and the required equipment is a salt spray tester.
The purpose of vibration testing is to check whether the board can pass different levels of random vibration testing, and the required equipment is a vibration meter.
The purpose of high temperature and high humidity testing is to check the adaptability of circuit boards under harsh high temperature and high humidity conditions, and the required equipment is a constant temperature and humidity test chamber.
The purpose of solder strength thrust test is to test whether the solder strength of components meets the requirements, and the required equipment is a thrust meter.
If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects
Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.
mobile phone: 86-15113315665
Contact: Chen Changhai
mobile phone: 86-18676922028
E-mall: haibo_fpcba1668@163.com
Address: 3rd Floor, Building 2, Fuxing Industrial Park, Building B, Chuangye 1st Road, Jiangbian Community, Songgang Street, Bao'an District, Shenzhen