Acceptance criteria for PCB-深圳市海博精密电路有限公司

PCB 的验收标准是什么？

PCB 的验收标准是 PCB 为获得批准必须满足的特定特性、标准和要求。

PCB 验收标准通常包括：PCB 厚度和尺寸精度；PCB 表面光洁度质量；PCB 铜重量精度；PCB 阻焊层覆盖率、颜色和透明度；PCB 丝网印刷精度；电气性能测试，包括连续性、隔离性和电源完整性。

满足所有 PCB 验收标准对于确保 PCB 具有最高质量并在其预期应用中按预期运行至关重要。这将有助于最大限度地减少代价高昂的错误和重新设计，同时确保您从 PCB 投资中获得最大收益。对 PCB 验收标准的透彻理解对于成功生产 PCB 至关重要。

目前，最广泛接受的PCB验收标准是IPC-A-600标准。

IPC-A-600标准是什么

PC-A-600 是一项国际标准，概述了印刷电路板可接受的工艺标准。

它被广泛应用于整个 PCB 行业，是确保电路板制造质量必须满足的一套全面要求。

IPC-A-600 是确保每次生产和组装的 PCB 质量的一项基本指南。它是电路板领域的重要资源，参与生产或检验的任何人都应使用它。

IPC-A-600 是 PCB 制造商、设计师、装配工和质量保证专业人员的宝贵工具。IPC-A-600 标准涵盖了广泛的主题，包括裸露材料、镀铜、PCB 厚度和尺寸的公差、任何类型的视觉缺陷等。

在海博中我们遵循哪些 PCB 验收标准？

在海博，我们严格遵循 IPC-A-600 2 级和 3 级标准，以确保我们的 PCB 按照最高行业标准生产。此外，我们还将检查和交付符合客户特殊要求的 PCB，例如 PCB 尺寸、厚度、阻抗等的严格公差。

What are the main differences between IPC-A-600 Level 2 and Level 3

The IPC-A-600 standard was developed by IPC (Electronic Industry Council) and is an internationally recognized standard for printed circuit boards (PCBs).

IPC-A-600 specifies the acceptance requirements for PCBs and defines a series of levels based on the visual and functional acceptability of the circuit board, ranging from Level 1, Level 2, Level 3 to Level 3/A.

aspect	IPC-A-600 Level 2	IPC-A-600 Level 3
reliability	normal	tall
cost	normal	tall
Copper thickness	>=20um	>=25um
industry	Ordinary industrial and commercial products, such as consumer electronics, communication products LED、	High reliability electronic products such as automobiles, medical, aviation electronics, and life support systems
Inspection standards	The visual defect standards are relatively low, such as holes, voids inside holes, spots in solder mask layers, wire gaps, rings around drill holes, etc	There are high standards for visual defects, such as voids, voids inside holes, spots in solder mask layers, wire gaps, rings around drill holes, etc

Generally speaking, IPC-A-600 Level 2 ensures that all customers can be confident that the IPC-A-600 Level 3 circuit boards they receive meet the highest quality and safety standards.

Edge/contour of PCB

Qualified: Burrs cause rough edges on the board, but the edges are not damaged.

Qualified: The inward infiltration distance of the gap/halo is ≤ 50% of the board edge spacing, and the infiltration at any position is ≤ 2.54mm.

Unqualified: The warpage of the circuit board exceeds 0.75%.

Unqualified: There are continuous burrs at the edge of the fracture.

Unqualified: The halo and gap on the edge of the board exceed 50% of the distance between the board edges, or exceed 2.54mm.

Unqualified: The edges and corners of the board are damaged and delamination occurs.
PCB surface

Unqualified: There are fingerprints on the board surface; Copper surface corrosion affects performance.

Qualified: No indentation or indentation does not cause bridging between conductors; Indentation will not cause a reduction in line spacing of less than 20% for exposed burst fibers, and the medium thickness is equal to or greater than 0.09mm.

Unqualified: The distance between external impurities, garbage particles, and the nearest conductor is close to 0.125mm. The size has exceeded 0.8mm.

Unqualified: Scratches on the solder mask layer result in exposed copper, exceeding the above regulations.
Acceptable: Non sensitive scratch solder mask layer will not cause copper or metal exposure; The appearance is not obvious.

Unqualified: The indentation causes the exposed burst fibers to reduce the row spacing by more than 20%, and the medium thickness is less than 0.09mm.

Unqualified: The board surface exhibits cracking, delamination, blistering, and other phenomena.
solder resist

Unqualified: The solder mask layer is offset. On solder pads with a spacing greater than 1.25mm, the solder mask layer deviates by more than 0.05mm; On solder pads with a spacing greater than 0.65mm and less than 1.25mm, the solder mask layer shows an offset of more than 0.025mm.

Unqualified: The solder mask ink wrinkled, resulting in copper exposure.

Unqualified: Poor exposure of solder mask layer; The pad size is less than 20%.

Unqualified: Bubbles and oil droplets appear on the solder mask layer, with more than 25 pieces on each side exceeding 0.25mm or more than XNUMX% of the circuit spacing.

Unqualified: Stripping of solder mask layer leads to copper exposure; The solder mask ink is broken, and the distance between the broken part and the nearest conductor exceeds 50%.

unqualified: The characters on the PAD are blurry and difficult to recognize.
Copper trace

Unqualified: The gap in the circuit is greater than 20% of the conductor width; The circuit was scratched, exposing the copper.

Unqualified: The circuit is too thin, less than 20% of the conductor width.

Unqualified: The warpage of the circuit board exceeds 0.75%.

Unqualified: The circuit has rough burrs with a size greater than 20% of the conductor spacing.

Unqualified: There is a short circuit.

Unqualified: Poor circuit wiring can affect electrical performance.
Through-hole/hole

Unqualified: Broken holes and welded rings both exceed 90 °.

Unqualified: Blocking the hole will result in the inability to install components.

Unqualified: The warpage of the circuit board exceeds 0.75%.

Unqualified: There is a lump inside the hole; The diameter of the hole is smaller than the minimum value specified in the procurement documents.

Qualified: The incorrect nature of the hole can affect the assembly of the component.

Unqualified: There are missing boreholes, multiple boreholes, wrong boreholes, etc.
solder resist

Unqualified: solder pad on Wuxi; The desoldering area of the solder pad is greater than 5%.

unqualified: The indentation and edge defects of BGA pads are greater than 10% of the pad diameter; The defect is greater than 20% of the circumference of the connecting pad.

Unqualified: There is ink on the solder pad, which affects the soldering performance.

Unqualified: The scratch gap on the solder pad exceeds 20% of the size.

Unqualified: The solder pads have phenomena such as oxidation, missed plating, and plating peeling, which affect the welding performance.

Unqualified: The gasket is twisted and defective.
Carbon ink, blue peelable facial mask, high temperature facial mask

Unqualified: Carbon oil short circuited, affecting performance.

Unqualified: Blue glue covers other processing areas.

Unqualified: There is a hole on the blue glue.

Unqualified: There is leakage of high-temperature adhesive.

Qualified: The high-temperature adhesive covers the holes used for installing components.

Unqualified: There are missing boreholes, multiple boreholes, wrong boreholes, etc.
Outline/Shape

Unqualified: The dimensions of the external dimensions exceed the required values or tolerances in the procurement documents.

unqualified: V-CUT causes copper damage; V-CUT shows deviation.

unqualified: V-CUT leakage connection; The depth of V-CUT does not meet the requirements of the procurement documents.

Unqualified, drilled too many slots; Some parts of the board are missing CNC milling machine machining; Incomplete contour machining by CNC milling machine; CNC milling machine contour machining leads to exposed copper; The board size does not meet the requirements of the procurement documents.

The unqualified V-CUT is too deep, causing the board to break; The depth of V-CUT exceeds the depth required in the procurement documents.

Unqualified: missing diagonal edge of golden finger; The beveled edge is damaged, causing the copper surface of the golden finger to be exposed; The depth and angle of the oblique edge do not meet the requirements of the procurement documents.
WHY CHOOSE US

If pursuing cost-effective FPC manufacturing services, choosing a Chinese manufacturer is the best choice. As a manufacturing powerhouse, China has abundant resources, cheap labor, and a large number of technical personnel. We recommend Haibo, a Chinese FPC assembly service provider with over 10 years of experience, who has performed outstandingly in various aspects

Efficient and reasonable quotation:There is an efficient quotation process to assist you in making decisions, providing reasonable prices and highly competitive quotes in China.
High quality and reliable products:Produce high standard printed circuit boards, manufacture and test according to specifications, international standards, and internal controls, and conduct pre production inspections to ensure robust processes.
Quick and on-time delivery:The assembly equipment is in good condition, with high productivity, minimal downtime, short delivery time, and also provides urgent services.
Timely and effective response:Always respond to customer needs, provide accurate information, answer questions through multiple channels, and offer one-stop services.
Strong technical strength:China's FPC manufacturing technology is leading, and Haibo has a complete SMT solution that covers assembly, inspection, and other capabilities. It also provides prototype production and customization services.
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