Adding integrated copper coins or solid copper materials inside or below the PCB surface is called embedding in the PCB. Embedded copper coin PCB is used to maintain thermal management and heat dissipation of PCB. This can be achieved through various technologies, such as heat sinks, thermal pads, thermal through holes, solid copper, or copper infusion designs. All of these technologies can be used individually or in combination, and they help reduce heat dissipation on printed circuit boards. The types of embedded copper coin PCBs are as follows.
The buried copper coin method involves placing copper coins inside the PCB, which cannot be seen through the outer layer of the PCB. In this method, heat from the outer layer of the PCB (generated due to high-density current flow) is transferred to the inner copper coin through thermal vias, and since copper is a good thermal conductor, this heat can diffuse throughout the entire copper, thereby reducing heat. In addition, they can be transferred to the other side of the heat sink or power/ground copper outer layer.
After PCB stacking, perform cavity processing and place embedded copper coins into the cavity. Fixing copper coins to the PCB helps with thermal management and heat dissipation. For embedded copper coins, we have different coin structures that are placed from the top to the bottom of the PCB.
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