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Technology
Electronic manufacturing process
Step 7: Aging test 


Aging testing is another quality screening process that accelerates potential defects in products by applying voltage and temperature. According to customer requirements, control voltage values, temperature, and aging time to detect faulty products. The aging furnace includes slots or mesh drives for loading aging boards.
 

The aging board is composed of sockets, and the units are installed or inserted into the sockets. Circuit boards and sockets have specific tool lifetimes, typically measured by the number of insertions or loads, and must be monitored and maintained to ensure proper testing of the unit. The circuit board and socket materials should also be able to withstand high temperatures and repeated bias cycles. Units that fail the aging test will be screened out, and further fault analysis will be conducted on severely rejected units.
 

The oven should also be regularly calibrated and undergo preventive maintenance to maintain consistent and accurate temperature and testing capabilities. During preventive maintenance, the active and passive components of the aging board will be inspected and replaced as necessary. The productivity of the aging testing process depends on the oven capacity, aging time, and board capacity.









        
  • Step 1: DFM CheckStep 1: DFM Check
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  • Step 2: Purchase PCBs and electronic componentsStep 2: Purchase PCBs and electronic components
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  • Step 3: PCB assemblyStep 3: PCB assembly
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  • Step 4: IC ProgrammingStep 4: IC Programming
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  • Step 5: Functional testingStep 5: Functional testing
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  • Step 6: Box assemblyStep 6: Box assembly
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