The structure of multi-layer FPC is usually composed of multiple layers of materials, including substrate layer, copper foil layer, cover film layer, adhesive layer, etc.
Substrate layer: It is the most basic structural layer of FPC, usually made of polyimide (PI) or polyester (PET) materials, which have excellent flexibility, heat resistance, and mechanical strength.
Copper foil layer: It is the conductive layer of FPC, usually using electrolytic copper foil or rolled copper foil, and its thickness directly affects the conductivity and durability.
Covering film layer: used to protect copper foil circuits from external environmental influences (such as moisture, dust, mechanical damage, etc.), usually made of the same material as the substrate.
Adhesive layer: mainly used to bond materials from different layers together, common adhesive materials are acrylic and epoxy resin.
In addition, multi-layer FPC may also include solder mask layers and surface treatment layers to meet the needs of different circuit designs.
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