These types of PCBs require very high precision due to their complex design patterns. This type of design is very complex, which may affect its functionality and yield, as the likelihood of errors occurring during the manufacturing process increases.
Continuous engineering innovation is needed to address the issue of equipment miniaturization while maintaining or enhancing the sensitivity and responsiveness of PCB capacitors.
PCB capacitive sensors are highly sensitive to environmental factors, including temperature, humidity, and electromagnetic interference.
These factors may alter the dielectric properties of the materials used and ultimately lead to changes in capacitance, resulting in unstable touch response. Protective coatings and carefully selected materials are essential for mitigating these effects.
The merging of PCB capacitive sensors involves the use of special materials and more precise manufacturing processes, which can lead to higher production costs.
This is because etching conductive layers requires high precision, which not only requires testing functional accuracy, but also makes PCBs more expensive compared to standard PCBs.
These challenges require a comprehensive understanding of the technical aspects of capacitive PCB design and the economic factors that affect its production.
This is crucial for advancing technological development and maintaining its universal applicability to a wide range of devices.
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