Laser drilling in blind and buried hole PCBs-深圳市海博精密电路有限公司

Laser drilling technology for blind hole machining has the advantages of high precision, strong universality, high efficiency, low cost, and significant comprehensive technical and economic benefits. Currently, it has become one of the key technologies in the field of modern blind hole PCB manufacturing. Before the emergence of lasers, only high hardness materials could be used to drill holes on lower hardness materials, making drilling on high hardness diamonds a complex task. After the emergence of lasers, this type of drilling became fast and safe in blind buried hole PCB manufacturing. However, the holes drilled by laser are conical instead of cylindrical like mechanical drilling, which is very inconvenient in some places of blind buried orifice plates. Programmable control of graphic output through galvanometer.

Laser drilling is the process of focusing a laser into a high-intensity heat source, heating the material to be drilled, melting or vaporizing the material within the laser action area, and then evaporating to form holes. The laser beam is highly concentrated in space and time, and using lens focusing can reduce the spot diameter to a laser power density of 5 ^ 10 to 15 ^ 10 w/cm2. Such high power density can be used for laser drilling on almost any material.

Laser drill, as a type of blind hole in HDI PCB, has its characteristics in PCB manufacturing:

Aperture size: 4-6 mil.

The thickness of PP should be less than or equal to 4.5 mil, calculated based on an aspect ratio of less than or equal to 0.75:1.

You can choose three types of PP: LDPP：106 / 1080； FR4：106 / 1080； RCC。

Can achieve a large aspect ratio.

No tool waste. Laser drilling is a non-contact machining process. Avoiding the problem of drill bit breakage in mechanical drilling.

Suitable for large-scale, high-density drilling.

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