Application of BGA Assembly-深圳市海博精密电路有限公司

Car:Due to the higher packaging density of ball grid array components, more functions can be integrated on one board. In the automotive industry, many in car devices require diversified functions to further improve efficiency and performance, such as navigation systems, instrument panels, etc.

space flight:Due to its good heat dissipation performance, BGA PCB can be used in aerospace equipment, as the aerospace industry requires high thermal cycling of equipment and requires high heat dissipation performance in dynamic environments.

Industrial equipment:The industrial environment requires high thermal stability of equipment, so BGA assembly can be used for industrial equipment such as control systems, motor drivers, and instruments.

Computers and mobile devices:Daily devices such as computers and smartphones require small space occupation, good heat dissipation, and low impedance, all of which are suitable for BGA packaging. The compact design of BGA is conducive to the lightweight of mobile phones and the multifunctionality of computers.

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