Key factors in aluminum substrate manufacturing-深圳市海博精密电路有限公司

In order to optimize thermal conductivity and improve performance, they are implemented in printed circuit boards, which involves several steps.

The first is the choice of substrate. Our core is aluminum substrate, which is made of aluminum alloys with high thermal conductivity such as 6061 and 5052.

We bond dielectric materials such as polyimide or epoxy resin onto this substrate material. These dielectric materials are thermally conductive and electrically insulating materials, which we implement together with the substrate during manufacturing. The main thing to keep in mind during the manufacturing process is to ensure effective adhesion between the aluminum core and the dielectric layer.

The thickness of the copper layer must be maintained to achieve better heat dissipation and optimize electrical performance.

The conductive traces on the circuit board are manufactured using etching technology, which is used in normal PCB manufacturing

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