Although aluminum PCBs have various advantages, their overall composition also has some drawbacks and limitations.
Limited number of layers
Aluminum circuit boards are limited to single-layer or double-layer structures, and due to the nature of their production process, multi-layer structures are difficult to manufacture. This layer limitation limits their applicability to complex multi-layer designs.
Poor flexibility
Compared with PCBs made of flexible materials such as polyimide and polyester, aluminum core PCBs do have very low flexibility. The rigidity of aluminum PCB can be challenging in applications that require repeated bending or bending of the PCB. This will cause mechanical stress on the PCB, and even worse, lead to PCB failure.
Thermal expansion mismatch
The thermal expansion coefficient of aluminum substrate is relatively high compared to some electronic components and solder materials. Mismatching thermal expansion can lead to mechanical stress, solder joint failure, and sometimes delamination, all of which can damage the reliability of the device. PCB assembly
Considerations for metal substrates
The metallic properties of aluminum substrates will provide unique considerations in the manufacturing and assembly process of aluminum PCBs. This will increase the complexity and potential cost of the manufacturing process.
cost considerations
Although aluminum based PCBs play a good role in thermal management, their price is slightly higher compared to traditional PCB substrates such as FR-4. This is because the cost of aluminum substrate PCB, the specialized manufacturing process used, and additional surface treatment options all lead to an increase in the manufacturing cost of aluminum substrate PCB.
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