PCB
Aluminum oxide PCB
Characteristics of Aluminum Oxide Printed Circuit Board

Some characteristics of aluminum oxide PCB include:

Thermal stability - This PCB performs almost unchanged at extreme temperatures and can operate at temperatures as high as 300 ° C and as low as -55 ° C in a short period of time.

Thermal conductivity - Aluminum oxide has a very high thermal conductivity. Its thermal conductivity range is 18 to 30 W/mK, which varies depending on the batch and type of aluminum oxide PCB board used. In contrast, the thermal conductivity of ordinary FR4 used in most general-purpose PCBs is 0.25 W/mK, the thermal conductivity of expensive high-speed dielectric material Isola Tachyon 100G is 0.42 W/mK, and the thermal conductivity of ordinary metal core PCBs ranges from 1 W/mK to 9 W/mK

Water absorption rate - The water absorption rate of alumina PCB is 0%. The porosity of alumina is extremely low, making its surface impermeable, which also contributes to its corrosion resistance. In contrast, the water absorption rate of FR-4 is about 0.1% to 0.2%.

Mechanical strength - Aluminum oxide ceramic PCB has a compressive strength of 300 MPa to 450 MPa, similar to the forced strength of FR-4. For mechanical strength, 300 Mpa is an impressive number.

Density - The matrix is very dense. Their density ranges from 3.6 g/cm ³ to 3.9 g/cm ³ depending on the variant of aluminum PCB. In contrast, the density of FR-4 is 1.8 g/cm ³, which is about half of that of an alumina PCB board.

Chemical inertness - Aluminum oxide PCB boards can withstand a variety of solvents, whether alkaline, acidic, or organic. PCB is also less prone to corrosion over a long period of time.

Dielectric constant - The dielectric constant range of ceramic PCBs is 9 to 10, which is quite high. In contrast, the dielectric constant of FR4 is approximately 4 to 4.6, while the dielectric constant of Isola Tachyon 100G is 3.02. A high dielectric constant means that the electrical energy storage of the PCB substrate is higher.

Dissipation factor - The dissipation factor (Df) of aluminum oxide PCB ranges from 0.0001 to 0.001, depending on the type of aluminum oxide and the frequency of the signal. The dissipation factor of alumina PCB is extremely low and lower than most PCB substrate materials. In contrast, the dissipation factor of FR4 is 0.015 to 0.025, while the Df of Isola Tachyon 100G is 0.0025 to 0.0035.

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