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Acceptance criteria for PCBA
Array arrangement and welding of surface mount surfaces 


 
 
 
  
 
    
  
 
  

   Goal: Place BGA solder balls in the center of the solder pads without offset, continuous soldering, false soldering, or empty soldering.
  
 
 
 
 
 
  
 
    
  
 
  
 
 
 
 
 
  
 
    
  
 
  

   The following figure shows the defect: bridging between solder joints was found through visual inspection or X-ray examination.
  
 
 
 
 
 
  
 
    
  
 
  

   The following figure shows the defect: the welding is in a "waist shape", indicating that the solder ball and solder paste are not flowing together.
  
 
 
 
 
 
  
 
    
  
 
  

   The following figure shows the defect: incomplete reflow of solder paste on BGA solder balls. Solder fracture.
  
 
 
 










        
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